Specifications can be modified according to customer requirements. Max Wire Dia. & profile wire: 0.01 – 30mm Max winding length: 1380 mm Max distance between...
Specification Program: Microprocessor controlled, capable of holding 999 program sequences which may be run independently or in selected blocks for compound windings. Control: Spindle drive...
Specification Program: Microprocessor controlled, capable of holding 999 program sequences which may be run independently or in selected blocks for compound windings. Control: Spindle drive...
Specification Program: Microprocessor controlled, capable of holding 999 program sequences which may be run independently or in selected blocks for compound windings. Control: Spindle drive...
Reflow Oven T-937 solder leadfree paste very well. This oven can connect with PC, easy to input/set/transmit/adjust/save/manage wave data. The control software is with wave...
Infrared Reflow Oven T-937M solder leadfree paste very well. Adopt stable and high-speed MCU and advanced intelligent temperature measurement technology, temperature in the oven is...
The INFRARED IC HEATER T962 is a micro processor controlled reflow-oven. It can be used for effectively soldering various SMD and BGA components. The whole...
The INFRARED IC HEATER T962A is a micro processor controlled reflow-oven. It can be used for effectively soldering various SMD and BGA components. The whole...
This oven solder leadfree paste very well. The control software is with wave printing function, easy to save/manage/analysis the wave data. Adopt stable and high-speed...
INFRARED IC HEATER T962C works automatically by micro-computer control. Can satisfy SMD, BAG Soldering requests. Whole soldering process can be completed automatically, easy to use, Adopts...
Key Specifications/Special Features: These machines stack standard EI, UI & EE laminations in a wide range of sizes, from EI-19 to EI-162. Other sizes are...